NASA tech briefs. 66-10245. Rugged microelectronic module package supports circuitry on heat sink.
Publication Title:
Rugged microelectronic module package supports circuitry on heat sink.
Display Title:
NASA tech briefs. 66-10245. Rugged microelectronic module package supports circuitry on heat sink.
Series Title:
NASA tech briefs.
Corporate Agency Authors:
National Aeronautics and Space Administration
Sort Author:
National Aeronautics and Space Administration
Author place:
Washington, D.C.
Author zip:
20546
Date:
June 1966
Publish Date ISO Format:
1966-06-01T00:00:00Z
Publication Start:
19660601
Publication End:
19660630
Corporate/Agency Author:
National Aeronautics and Space Administration
Publication month:
7
Publication year:
1966
SuDoc number:
NAS 1.29:(nos.)
Description:
[2] p. il. 4°
Notes:
([MSC-81A.]) and [Issued by Technology Utilization Division to sum' marize specific technical innovations derived from the space program. [Issued with perforations.]
Notes:
[Issued by Technology Utilization Division to sum' marize specific technical innovations derived from the space program. [Issued with perforations.] Φ For Sale by OTS, Commerce Dept. Paper, each 15c.
Availability:
Φ For Sale by OTS, Commerce Dept. Paper, each 15c.