NASA tech briefs. 67-10335. Method of improving contact bonds in silicon integrated circuits.
Publication Title:
Method of improving contact bonds in silicon integrated circuits.
Display Title:
NASA tech briefs. 67-10335. Method of improving contact bonds in silicon integrated circuits.
Series Title:
NASA tech briefs.
Corporate Agency Authors:
National Aeronautics and Space Administration
Sort Author:
National Aeronautics and Space Administration
Author place:
Washington, D.C.
Author zip:
20546
Date:
Sept. 1967
Publish Date ISO Format:
1967-09-01T00:00:00Z
Publication Start:
19670901
Publication End:
19670930
Corporate/Agency Author:
National Aeronautics and Space Administration
Publication month:
4
Publication year:
1967
SuDoc number:
NAS 1.29:(nos.)
Description:
1 p. 4°
Notes:
(MFS-1753.) and [Issued by Technology Utilization Division to summarize specific technical innovations derived from the space program. Issued with perforations.]
Notes:
[Issued by Technology Utilization Division to summarize specific technical innovations derived from the space program. Issued with perforations.] Φ For Sale by OTS, Commerce Dept. Paper, each 15c.
Availability:
Φ For Sale by OTS, Commerce Dept. Paper, each 15c.