NASA tech briefs. 67-10454. Warpage eliminated in copper-clad microwave circuit laminates.
Publication Title:
Warpage eliminated in copper-clad microwave circuit laminates.
Display Title:
NASA tech briefs. 67-10454. Warpage eliminated in copper-clad microwave circuit laminates.
Series Title:
NASA tech briefs.
Corporate Agency Authors:
National Aeronautics and Space Administration
Sort Author:
National Aeronautics and Space Administration
Author place:
Washington, DC
Author zip:
20546
Date:
Nov. 1967
Publish Date ISO Format:
1967-11-01T00:00:00Z
Publication Start:
19671101
Publication End:
19671130
Corporate/Agency Author:
National Aeronautics and Space Administration
Publication month:
2
Publication year:
1967
SuDoc number:
NAS 1.29:(nos.)
Description:
[2] p. il. 4°
Notes:
([MFS-13S92.]) and [Issued by Technology Utilization Division to summarize specific technical innovations derived from the space program. Issued with perforations.]
Notes:
[Issued by Technology Utilization Division to summarize specific technical innovations derived from the space program. Issued with perforations.] Φ For Sale by OTS, Commerce Dept. Paper, each 15c.
Availability:
Φ For Sale by OTS, Commerce Dept. Paper, each 15c.