NASA technical note TN (series). D-4743. Stress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements [with list of references]; by John S. Przybyszewski.

Publication Title:
Stress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements [with list of references]; by John S. Przybyszewski.
Display Title:
NASA technical note TN (series). D-4743. Stress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements [with list of references]; by John S. Przybyszewski.
Series Title:
NASA technical note TN (series).
Corporate Agency Authors:
National Aeronautics and Space Administration
Sort Author:
National Aeronautics and Space Administration
Authors:
Przybyszewski, John S.
Author place:
Washington, DC
Author zip:
20546
Date:
Aug. 1968
Publish Date ISO Format:
1968-08-01T00:00:00Z
Publication Start:
19680801
Publication End:
19680831
Corporate/Agency Author:
National Aeronautics and Space Administration
Publication month:
5
Publication year:
1968
SuDoc number:
NAS 1.14:D-(nos.)
Description:
cover title, [2]+20 p. il. 4°
Notes:
Φ For Sale by OTS, Commerce Dept. Paper. $3.00.
Availability:
Φ For Sale by OTS, Commerce Dept. Paper. $3.00.
Monthly Catalog date:
November 1968
Monthly Catalog issue number:
886
Monthly Catalog page number:
1
Monthly Catalog issue date:
1968-11-01T00:00:00Z
Monthly Catalog entry number:
16197
Record start page number:
89

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