- Publication Title:
- Prevention of tin-lead overhang in plated copper-clad printed wiring boards, final report.
- Display Title:
- AEC research and development reports. BDX-613-670. Prevention of tin-lead overhang in plated copper-clad printed wiring boards, final report.
- Series Title:
- AEC research and development reports.
- Corporate Agency Authors:
- Atomic Energy Commission
- Sort Author:
- Atomic Energy Commission
- Author place:
- Washington, DC
- Author zip:
- 20545
- Date:
- Feb. 1973
- Publish Date ISO Format:
- 1973-02-01T00:00:00Z
- Publication Start:
- 19730201
- Publication End:
- 19730228
- Corporate/Agency Author:
- Atomic Energy Commission
- Publication month:
- 11
- Publication year:
- 1973
- SuDoc number:
- Y 3.At 7:22/(letters-nos.)
- Description:
- cover title, 29 p. il. 4°
- Notes:
- (Technical Information Center.) [Bendix Corporation, Kansas City, Mo.]
- Notes:
- (Technical Information Center.) [Bendix Corporation, Kansas City, Mo.] Φ For Sale by OTS, Commerce Dept. Paper, $4.00
- Availability:
- Φ For Sale by OTS, Commerce Dept. Paper, $4.00
- Monthly Catalog date:
- August 1973
- Monthly Catalog issue number:
- 943
- Monthly Catalog page number:
- 1
- Monthly Catalog issue date:
- 1973-08-01T00:00:00Z
- Monthly Catalog entry number:
- 26985
- Record start page number:
- 5