Special publication. 400-2. Semiconductor measurement technology: Microelectronic ultrasonic bonding [with list of references; by] George G. Harman.
Publication Title:
Semiconductor measurement technology: Microelectronic ultrasonic bonding [with list of references; by] George G. Harman.
Display Title:
Special publication. 400-2. Semiconductor measurement technology: Microelectronic ultrasonic bonding [with list of references; by] George G. Harman.
Series Title:
Special publication.
Corporate Agency Authors:
National Bureau of Standards and Commerce Dept.
Sort Author:
National Bureau of Standards
Authors:
Harman, George G.
Author place:
Gaithersburg, MD
Author zip:
20760
Date:
Jan. 1974
Publish Date ISO Format:
1974-01-01T00:00:00Z
Publication Start:
19740101
Publication End:
19740131
Corporate/Agency Author:
National Bureau of Standards
Publication month:
12
Publication year:
1974
SuDoc number:
C 13.10:400-2
Description:
vi+102+[15] p. il. 4°
Notes:
(Electronic Technology Division, Institute for Applied Technology.) [Jointly supported by Defense Nuclear Agency, Navy Strategic Systems Project Office, and National Aeronautics and Space Administration.]
Notes:
(Electronic Technology Division, Institute for Applied Technology.) [Jointly supported by Defense Nuclear Agency, Navy Strategic Systems Project Office, and National Aeronautics and Space Administration.] • Sent to Depository Libraries. Item 247
Availability:
* For Sale by Superintendent of Documents. Paper, $1.25. and • Sent to Depository Libraries. Item 247