AEC research and development report. BDX-613-839 (Rev.). Flatpack soldering to solder-leveled printed wiring boards, final report [with list of references; prepared by R. S. Morris].
Publication Title:
Flatpack soldering to solder-leveled printed wiring boards, final report [with list of references; prepared by R. S. Morris].
Display Title:
AEC research and development report. BDX-613-839 (Rev.). Flatpack soldering to solder-leveled printed wiring boards, final report [with list of references; prepared by R. S. Morris].
Series Title:
AEC research and development report.
Corporate Agency Authors:
Atomic Energy Commission
Sort Author:
Atomic Energy Commission
Authors:
Morris, R. S.
Author place:
Washington, DC
Author zip:
20545
Date:
Oct. 1973
Publish Date ISO Format:
1973-10-01T00:00:00Z
Publication Start:
19731001
Publication End:
19731031
Corporate/Agency Author:
Atomic Energy Commission
Publication month:
3
Publication year:
1973
SuDoc number:
Y 3.At 7:22/BDX-613-839 (Rev.)
Description:
cover title, 29 p. il. 4°
Notes:
[Contract AT(29-1)-613 USAEC; Bendix Corporation, Kansas City, Mo.]
Notes:
[Contract AT(29-1)-613 USAEC ; Bendix Corporation, Kansas City, Mo.] @ For Sale by National Technical Information Service, Springfield, VA 22151. Paper. $4.00.
Availability:
@ For Sale by National Technical Information Service, Springfield, VA 22151. Paper. $4.00.